Next Generation MEMS Test Chip
نویسندگان
چکیده
After testing each device on the old demonstration chip, new ways of improving it were explored. The previous test chip had several redundant devices which limited the opportunities to characterize the structural films. As a result, the next generation chip was laid out with new and redesigned devices that allow students to explore parameters and concepts significant to MEMS, i.e. stress, strain, Young’s Modulus, spring constants, line width, stiction, and electro-dynamics. This test chip will be submitted to the Multi-User MEMS Processes(MUMPS) for fabrication.
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